Senior Principal Packaging Engineer

This engineer will lead the creation of package structures, materials, and assembly processes that balance electrical and mechanical performance, reliability, manufacturability, and cost. They will coordinate technical programs across design, product engineering, manufacturing, quality, testing, suppliers, outsourced assembly partners, and business teams. The position supports new product and technology introductions, including prototypes, characterization, qualification, risk reduction, release, and ramp-up. It also involves tracking emerging developments such as panel-level packaging, advanced integration, and high-power solutions while shaping related technology roadmaps. The role is suited to an experienced semiconductor packaging professional who can guide complex projects, explain technical decisions to varied audiences, and contribute deep expertise in at least one advanced packaging domain.