NXP Semiconductors is a Dutch public company that makes semiconductors, and its Arizona operation, a campus in Chandler with two wholly owned wafer fabs, is in transition: NXP announced in December 2025 that it plans to close the Chandler gallium nitride (GaN) fab by 2027; its annual report published Feb. 19, 2026, still listed the fab as of Dec. 31, 2025, and no later update on the closure was found. Nokia disclosed on July 23, 2026, a definitive agreement to acquire the Chandler campus, with closing expected in the first quarter of 2029; no later update on the deal was found. NXP was incorporated in the Netherlands in 2006, its principal executive office is at High Tech Campus 60 in Eindhoven, and its common shares trade on the Nasdaq Global Select Market under the symbol NXPI. Its annual report says its products are used in automotive, industrial and Internet of Things (IoT), mobile, and communication infrastructure applications. NXP reported worldwide revenue of $12,269 million for 2025, compared with $12,614 million for 2024, and employed approximately 32,169 people worldwide at the end of 2025, including approximately 1,439 in its SSMC joint venture. The filing gives no Arizona headcount.
In Arizona, NXP works at the wafer fabrication stage of chipmaking, the front end where circuits are built on silicon wafers. Its 2025 annual report lists two wholly owned front-end fabs in Chandler: an 8-inch wafer fab making CMOS, eNVM and BCDMOS chips at line widths of 0.18 to 0.50 micron, and a 6-inch gallium nitride (GaN) fab listed as Chandler RF, at 0.25 to 0.40 micron. NXP said in 2024 that Chandler was home to two of its five front-end fabs. The facts gathered show no AI role for the Arizona fabs themselves. NXP's AI move is company-wide: on October 27, 2025, it closed the acquisition of Kinara, Inc. for $284 million in cash, a maker of edge AI processors [not independently verified], and no Arizona link to that deal is stated. NXP's documented ties to TSMC are outside Arizona, including a 10% stake in the TSMC-majority ESMC fab in Dresden, Germany, where initial production was targeted for 2028 as of NXP's 2025 annual report, with no later update found; neither the 2025 annual report nor the second-quarter 2026 report mentions Intel or TSMC operations in Arizona.
NXP's Chandler operation is older than NXP. The company says the Chandler Fab shipped its first silicon in 1994. Freescale, the semiconductor business that came out of Motorola [not independently verified], was separated from Motorola in 2004, and NXP acquired Freescale on December 7, 2015, for a total consideration of $11.6 billion, which is how the Chandler fab came to NXP [not independently verified]. In 2024 NXP said the Chandler Fab occupied an 80-acre site with 200,000 square feet of manufacturing space and that some 750 employees kept it running. NXP's 2019 annual report listed 1,173,196 square feet of owned building space at Chandler, a broader measure than manufacturing space.
On September 29, 2020, NXP announced the grand opening of a 150 mm (6-inch) RF gallium nitride fab in Chandler, which it described as the most advanced fab dedicated to 5G RF power amplifiers in the United States. NXP's release quoted Joakim Sorelius of Ericsson, which NXP called a longstanding customer. In December 2023, Arizona State University announced that, with support from the Arizona Commerce Authority and in partnership with NXP, it had received a $17.5 million investment to expand fan-out wafer-level packaging research and workforce training. The money went to ASU, not to NXP. ASU said the expansion would also include internships, joint research and next-generation GaN research for 6G in partnership with NXP in Chandler. No update on that partnership after December 2023 was found; the NXP radio power group that led it is the business NXP announced in December 2025 it is exiting [not independently verified].
Five years after that opening, NXP reversed course. In December 2025 it announced plans to stop making its radio power product line and to close the GaN fab in Chandler, which Light Reading reported is expected to produce its last wafer in the first quarter of 2027. No NXP update to that schedule after December 2025 was found. NXP said that given market realities with no outlook for recovery, the radio power business no longer fit its long-term strategy. At the time, NXP also said the Chandler facility producing other types of semiconductors would continue. Then, in a Form 6-K dated July 23, 2026, Nokia said it had a definitive agreement to acquire NXP's Chandler Semiconductor Fabrication campus. Subject to regulatory approvals, Nokia plans to lease manufacturing capacity in part of the facility starting in early 2027, convert the site to indium phosphide production for optical components, and then acquire the full site, with closing expected in the first quarter of 2029. Nokia said the deal adds U.S. indium phosphide capacity as domestic supply grows more important for the AI build-out. The filing states no price, and the sources do not say whether the 8-inch Chandler fab NXP said would continue is part of the sale; no NXP statement on the sale was found. No update on the deal after the July 2026 filing was found.
NXP also carries an environmental legacy in the Phoenix area. Its 2025 annual report says soil and groundwater contamination has been identified at its property near Phoenix and that remediation is expected to continue for many years. As of December 31, 2025, NXP had recorded $95 million for environmental remediation costs company-wide, the same as a year earlier; the filing does not say how much of that is for Arizona. Separately, an EPA fact sheet dated November 2018 names NXP USA, Inc., successor to Motorola Inc., and Honeywell International Inc. as two of the responsible parties for the M52 Site, conducting an investigation under EPA oversight. No later status of that investigation after November 2018 was found. The annual report does not name that site, so Arizona AI does not treat the two records as the same matter.
Taken together, the facts show a Chandler campus that NXP said in 2024 hosted two of its five front-end fabs and has a long chipmaking history, now in transition: as of December 2025, NXP expected its GaN fab to make its last wafer in the first quarter of 2027, and as of July 2026, Nokia planned to begin using part of the site in early 2027 and to take over the full campus, with closing expected in the first quarter of 2029.