APTD SWA Module Engineer On-Shift (Day shift)

This engineer works primarily on the manufacturing floor during an assigned shift, responding to equipment, process, and product issues that could interrupt production. Duties include troubleshooting, process recovery, lot disposition, inspections, development data collection, specification updates, and communication of critical issues across engineering and factory teams. The position is part of Intel’s Advanced Packaging Technology Development Substrate and Wafer Assembly organization, supporting the development and production of advanced packaging technologies. It suits a technically trained engineer with semiconductor or related process experience who is comfortable making decisions in a fast-paced, collaborative, on-site manufacturing environment. The role is based in Phoenix, Arizona, and does not offer immigration sponsorship.