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An independent guide to Arizona’s AI economyData refreshed daily · Aug 11, 2026
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MEOS - Module Engineer On Shift

IntelPhoenix, AZ$99,030.00-$139,810.00 USD annually

This position serves as the primary engineering contact for Manufacturing within a semiconductor packaging or assembly area. The engineer spends most of the workday on the production floor, responding to excursions, equipment problems, out-of-control events, and product or recipe concerns while documenting investigations and corrective actions. The role also supports development experiments, new operations, critical-lot data collection, improvement projects, and the release of held material. After helping introduce and stabilize new processes, the engineer trains and certifies manufacturing personnel. It suits a technically strong engineer who can prioritize competing requests, troubleshoot methodically, and collaborate effectively in a fast-paced high-volume production environment.

Requirements

Bachelor’s degree in engineering or materials science plus 2+ years of relevant experience, or a master’s degree plus 6+ monthsExperience in semiconductor equipment or product manufacturing, high-volume technology manufacturing, or automated manufacturingStrong technical problem-solving and data-analysis skillsAbility to collaborate across Manufacturing, Engineering, Quality, and equipment teamsExperience with semiconductor fab or package assembly is preferredAbility to work primarily on-site and spend more than three-quarters of the time on the production floor
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Listed August 11, 2026 · Verify details with the employer before applying.

About Intel

Four decades of chip manufacturing in Chandler, with the Ocotillo campus among Intel's largest fab sites and ongoing expansion.