(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging

This senior technical leadership role focuses on driving innovation in high-thermal-conductivity thin films that are critical for advanced semiconductor packaging and heterogeneous integration. You'll oversee a team of process development engineers working across ALD, PEALD, CVD, and PECVD technologies to develop materials that meet demanding customer requirements for thermal management. The position bridges technical excellence with business priorities, requiring you to translate customer needs into breakthrough processes while collaborating across hardware engineering, product management, and global R&D. This role suits experienced semiconductor process engineers who have successfully brought new technologies to market, possess deep expertise in advanced deposition techniques, and can build and lead high-performing technical teams in a competitive, fast-paced environment.