Packaging Module Equipment Development Engineer

This engineer will work within Intel’s packaging technology and manufacturing organization to develop equipment, process specifications, qualification methods, and reliability solutions for next-generation packages. Responsibilities include supporting equipment and materials, analyzing process data, applying DOE and statistical methods, and resolving manufacturing or customer-driven packaging issues. The role also partners with suppliers, contract assemblers, procurement, quality teams, and engineering groups to maintain standards and deliver product milestones. It suits an experienced semiconductor or manufacturing engineer who enjoys hands-on equipment development, technical problem solving, experimentation, and cross-functional project leadership. Regular onsite work in Phoenix, Arizona is required.