EMIB-T Substrate Yield Lead

This position leads end-to-end substrate yield activities for EMIB-T, including data analysis, defect pareto reduction, process optimization, readiness reviews, and risk mitigation. The role sits at the intersection of advanced packaging technology development, manufacturing, supplier management, and product integration, supporting both Intel Foundry Services and Intel Product Groups. It also develops scalable yield intelligence capabilities such as dashboards, automated analytics, computer vision, and AI/ML-based defect detection. The successful candidate is an independent technical leader who can resolve complex issues quickly, influence diverse stakeholders, and maintain accountability in a high-visibility environment. It suits an experienced semiconductor, substrate, packaging, or yield engineering professional with strong analytical skills and program execution experience.