Physical Failure Analysis Engineer II

This engineer supports semiconductor failure analysis by locating and characterizing defects across multiple device and package technologies. The work includes operating Dual Beam FIB/SEM equipment, preparing samples for cross-sections and TEM, and using decapsulation, milling, X-ray, and acoustic microscopy techniques. The position is part of a laboratory-based engineering function that partners with other teams to explain failures and improve products and analysis processes. It also involves maintaining equipment, producing clear technical reports, and following chemical, machinery, and EHS requirements. This opportunity suits a hands-on failure analysis professional with 2–5 years of semiconductor or electronics laboratory experience and strong knowledge of packaging and device structures.