Physical Failure Analysis Engineer II

The Physical Failure Analysis Engineer II performs detailed examination and analysis of failed semiconductor devices using specialized laboratory equipment and techniques. Working within Microchip's failure analysis function, this position focuses on sample preparation, microscopy analysis, and defect characterization to identify why components fail. The role requires hands-on expertise with Dual Beam FIB/SEM systems, various decapsulation methods, and complementary analysis tools like X-ray and acoustic microscopy. This position suits technically skilled professionals who enjoy problem-solving with precision instrumentation and who want to contribute to improving product reliability and manufacturing processes at a major semiconductor company.