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Updated daily · Sep 13, 2026
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Process Integration Engineer

TSMCPhoenix, AZ

This engineer supports semiconductor products from introduction through manufacturing by integrating process steps and resolving issues affecting yield, electrical performance, and reliability. The position works closely with device, product, lithography, etch, thin-film, and other process engineering groups to develop stable, customer-focused solutions. Key activities include technology transfers, analysis of manufacturing data, experiment design, and root-cause investigations involving FEOL, MEOL, and BEOL processes. It suits candidates with a strong semiconductor engineering background who enjoy hands-on troubleshooting, ownership, and collaboration across geographically distributed teams. The job is based in Phoenix and requires on-site work, rotational shifts, and occasional weekend or night coverage.

Requirements

Bachelor’s, master’s, or Ph.D. in electrical engineering, materials science, or physicsExperience improving silicon process flows across FEOL, MEOL, and BEOLUnderstanding of process shifts, design rules, layout impacts, yield, performance, and reliabilityStrong data analysis, experimental design, and complex problem-solving skillsEffective communication and cross-functional teamwork abilitiesLegally eligible to work in the United States and willing to work on-site shifts
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Listed July 31, 2026 · Verify details with the employer before applying.

About TSMC Arizona

TSMC's planned $265 billion North Phoenix semiconductor campus is the largest foreign direct investment commitment in a greenfield project in U.S. history and anchors advanced AI chipmaking.

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