Senior Process Engineer – Substrate

This hands-on engineer will help build Syenta’s advanced packaging toolset, with particular emphasis on fine-line circuitry, dielectric patterning, and multilayer substrate fabrication. The position combines cleanroom process execution with recipe development, defect troubleshooting, inspection, data analysis, and process improvement. The engineer will collaborate with materials, chemistry, and engineering specialists in Sydney and support technology transfer to external manufacturing partners. The role suits an experienced microfabrication professional who is comfortable integrating multiple process steps and working toward scalable, high-yield production. Semiconductor packaging or interposer experience and familiarity with reliability testing would be valuable.