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Updated daily · Sep 19, 2026
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Failure Analysis Engineer

TSMCPhoenix, AZ

This engineer supports fab operations by analyzing semiconductor materials and failures with methods such as TEM, FIB, SEM, SIMS, XPS, or AES. They collaborate with customers and factory teams to clarify problems, develop solutions, and communicate useful findings. The position also maintains laboratory equipment, improves analytical processes, and assists technicians with tool and process challenges. Work may include cleanroom access, chemical handling with protective equipment, and participation in an on-call rotation. It suits a materials, physics, or engineering professional with graduate-level education, hands-on laboratory experience, strong analytical and communication skills, and flexibility to work in a fast-paced manufacturing environment.

Requirements

Master’s degree in materials science, physics, engineering, or related fieldAt least 1 year of laboratory experience, preferably in semiconductor R&D or high-volume manufacturingAt least 1 year of hands-on experience with TEM, FIB, SEM, SIMS, XPS, or AESStatistical analysis skills and proficiency with Microsoft Office; Power BI or SQL is a plusAbility to work independently, under pressure, and in an on-call support rotationWillingness to work on-site in Phoenix and perform cleanroom duties
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About TSMC Arizona

TSMC's planned $265 billion North Phoenix semiconductor campus is the largest foreign direct investment commitment in a greenfield project in U.S. history and anchors advanced AI chipmaking.

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