(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging

This senior leadership role focuses on advancing thermal management capabilities for semiconductor devices and advanced packaging applications. You will manage a team of process development engineers to design and optimize high thermal conductivity thin films and material stacks that meet evolving customer and industry demands. The position requires balancing technical innovation with customer collaboration, working across global R&D organizations, and maintaining thought leadership in thermal materials and semiconductor processing. This role suits experienced process engineers or materials scientists who have successfully brought semiconductor technologies from development to manufacturing, enjoy building and mentoring technical teams, and are passionate about solving complex thermal challenges in modern semiconductor packaging.