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Failure Analysis Technician F21
This technician works within the Product Failure Analysis function to investigate semiconductor device failures and provide reliable data to engineering teams. Responsibilities include FIB sample preparation, SEM, C-AFM, nano-probe operation, and TEM preparation activities such as site marking and de-layering. The technician also handles chemicals safely, assists with analytical method development, maintains 6S laboratory standards, and supports fab operations through assigned on-call coverage. The position suits someone with semiconductor failure analysis or TEM preparation experience who can work independently while collaborating effectively in a fast-paced manufacturing environment. Applicants should be comfortable with cleanroom work, shift and overtime assignments, and routine computer-based data organization and reporting.
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Listed July 19, 2026 · Verify details with the employer before applying.
About TSMC Arizona
TSMC's planned $265 billion North Phoenix semiconductor campus is the largest foreign direct investment commitment in a greenfield project in U.S. history and anchors advanced AI chipmaking.
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