Advanced Packaging Intern, MS - Summer 2027

The role focuses on electrical analysis of advanced packages, PCBs, and high-speed interconnects used in complex semiconductor systems. Working with packaging, layout, hardware, and intellectual property teams, the intern will run simulations, review power distribution networks and channels, and contribute to SI/PI verification and sign-off. The position also involves creating Python or MATLAB tools to streamline engineering workflows and communicating findings through technical documentation and presentations. It is suited to a master’s student in electrical or computer engineering who is interested in hardware design, electromagnetic behavior, advanced 2.5D/3D packaging, and practical simulation-based optimization.