Packaging Equipment Development Group Lead

This leader will manage equipment development activities within Intel’s Assembly Technology Development organization, focusing on semiconductor packaging and assembly capabilities. Responsibilities include introducing first-of-a-kind equipment, coordinating process and equipment integration, resolving manufacturing challenges, and building long-term capability roadmaps. The position involves close collaboration with manufacturing, automation, process integration groups, and external equipment suppliers. It also requires mentoring engineers, setting performance expectations, and fostering an inclusive, results-oriented team culture. The role suits an experienced semiconductor equipment or process-development professional with strong technical judgment, people leadership skills, and expertise in data-driven engineering methods.