Advanced Packaging Process Engineer

This engineer will help create and scale advanced semiconductor packaging processes that support Intel product launches and manufacturing operations. Responsibilities include developing assembly methods, qualifying equipment, analyzing process data, running structured experiments, and introducing improved materials or tools. The position works closely with manufacturing, engineering, and product teams while also contributing to specifications, technical documentation, and global process standardization. It suits a technically curious and collaborative engineer who can manage ambiguity, communicate complex findings clearly, and take ownership of improvement projects. Candidates may be early-career PhD graduates or experienced professionals with relevant manufacturing process development experience.