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Module Engineer On-Shift (MEOS) – Night Shift (4)
This entry-level engineer supports a 24x7 substrate packaging operation from the factory floor during a 6:00 PM to 6:00 AM rotating night schedule. They troubleshoot equipment, process, and product issues, recover errors, manage lot disposition, and assist with bringing new tools into production. The position also involves shift handoffs, technical documentation, panel inspection and imaging, and communication with tool and lot owners. It suits a self-directed, adaptable engineer who can make decisions under pressure and work closely with cross-functional manufacturing teams. Candidates should have a relevant engineering or science degree, with manufacturing, statistical process control, or semiconductor packaging experience being advantageous.
Requirements
Listed October 6, 2026 · Verify details with the employer before applying.
About Intel
Chipmaker that has manufactured in Arizona since 1979. Its Chandler Fab 52 makes chips on Intel 18A, the most advanced node made in the U.S., Intel says.
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