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Updated twice daily · Oct 6, 2026
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Module Engineer On-Shift (MEOS) – Night Shift (4)

IntelPhoenix, AZ$85,200.00-$139,810.00 USD annually

This entry-level engineer supports a 24x7 substrate packaging operation from the factory floor during a 6:00 PM to 6:00 AM rotating night schedule. They troubleshoot equipment, process, and product issues, recover errors, manage lot disposition, and assist with bringing new tools into production. The position also involves shift handoffs, technical documentation, panel inspection and imaging, and communication with tool and lot owners. It suits a self-directed, adaptable engineer who can make decisions under pressure and work closely with cross-functional manufacturing teams. Candidates should have a relevant engineering or science degree, with manufacturing, statistical process control, or semiconductor packaging experience being advantageous.

Requirements

Bachelor’s degree in materials, mechanical, chemical engineering, chemistry, physics, or a related field plus 1+ year of relevant experience, or a relevant master’s degreeAbility to troubleshoot equipment, process, and product issues in a manufacturing environmentStrong written and verbal communication skills for shift handoffs and stakeholder coordinationAvailability for the 6:00 PM–6:00 AM Shift 4 schedule with alternating three- and four-day work weeksExperience with Statistical Process Control is preferredSemiconductor packaging or packaging substrate manufacturing experience is preferred
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Listed October 6, 2026 · Verify details with the employer before applying.

About Intel

Chipmaker that has manufactured in Arizona since 1979. Its Chandler Fab 52 makes chips on Intel 18A, the most advanced node made in the U.S., Intel says.

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