Package Architecture Analyst

This position sits within Intel’s advanced packaging organization and guides package architecture from product requirements through tape-out and manufacturing transition. The architect makes cross-functional technology trade-offs, applies design-for-manufacturing and experimental methods, and drives improvements in design quality and production efficiency. They will troubleshoot package and manufacturing problems, maintain technical documentation, and help ensure reliable, cost-effective package outputs. The role is well suited to an experienced semiconductor packaging professional with strong analytical, communication, and leadership abilities. Candidates should be comfortable influencing teams across engineering and manufacturing while working on complex packaging technologies.